Product matrix
EFEM wafer transfer equipment
In a high-cleanliness environment, the Wafer front-end transmission system that moves single wafers through modules to the process and inspection modules mainly has the following functions: Wafer Mapping, RFID code reading, SIMI character OCR reading, and PA edge finding calibration.
Defect detection of lithography mask plates
It is mainly applied in the inspection stage of the production and manufacturing process of Photomask. Inspection is carried out on Photomask blanks to ensure its quality meets the requirements
Wire bonding defect detection
Die Bonding process: Detect defects such as missing Die, misalignment, cracks, solder joint offset, and wafer mounting tilt.
Wire Bonding process: Detect wire collapse, wire collision, wire breakage and other lead bonding defects.
Multiple main body function tests: covering IC appearance inspection, Wire line inspection, colloid inspection, substrate inspection, IC height inspection, etc
Phone Test Equipment
The light box is a fully enclosed structure with internal blackening treatment, forming a diffuse reflection environment.
Combined light sources to ensure uniform brightness.